According to SEMI’s latest forecast, global OEM sales of semiconductor manufacturing equipment are expected to reach a record high of $165.9 billion by 2026, a 23.2% increase compared to 2025. The 2nm process and the continued rising demand for advanced packaging technologies will become the main drivers of growth in the semiconductor equipment market. Additionally, according to SNS Insider market research reports, the global co-packaged optical (CPO) market size is projected to grow to $1.923 billion by 2035, with a compound annual growth rate (CAGR) of 35.70%.

Multi-axis positioning precision platforms, air bearing platforms, linear motors, and motion control systems featuring nanometer-level positioning accuracy, low thermal drift, high dynamic response, and optical active alignment integration capabilities will become key procurement items for manufacturers of advanced semiconductor packaging and co-packaging optical equipment. The CPO process requires a large amount of nanometer-level positioning, automated assembly, and optical measurement equipment, making precision motion control platforms one of the critical pieces of equipment integration/purchase options.

The 2026 Taipei Automation Exhibition and Semiconductor Taiwan Expo are approaching. We warmly welcome industry leaders and partners to visit our booths to discuss collaboration and develop your latest precision motion control platform products to meet market demands.