PBA at the 2026 Taipei Automation Show l DIGITIMES Beyond Automation Forum

Advancing Precision Motion Technologies for Next-Generation Semiconductor Packaging

PBA was pleased to participate in the 2026 Taipei Automation Show DIGITIMES Beyond Automation Forum, where industry leaders gathered to explore emerging automation and precision motion technologies shaping the future of advanced manufacturing.

Representing PBA Group, Daryl Tan, Regional Sales Manager, delivered a presentation titled: “Next-Gen Precision Motion Platform Technologies for Semiconductor Advanced Packaging & CPO in the AI Era.”

The presentation highlighted how increasingly sophisticated semiconductor packaging processes are driving the need for higher precision, greater motion synchronisation and improved thermal stability.

Precision Motion for Advanced Packaging

As AI applications continue to accelerate demand for advanced semiconductor packaging and Co-Packaged Optics (CPO), manufacturers face increasingly demanding requirements for precision motion and process control.

PBA showcased its expertise in several key motion technologies, including:

• High-precision thermal compression bonding gantries
• Dual-gantry precision platforms
• Air-bearing platforms
• Multi-axis precision motion control

These technologies are designed to support demanding manufacturing processes where accuracy, stability and coordinated motion are critical.

Addressing Thermal and Motion Challenges

High-temperature processes such as Thermo-Compression Bonding (TCB) can introduce challenges related to thermal expansion and structural deformation.

PBA addresses these challenges by integrating thermal deformation suppression technologies with high-precision, synchronised multi-axis motion control.

These capabilities support advanced semiconductor processes including:

Flip-Chip Bonding | Thermo-Compression Bonding (TCB) | Hybrid Bonding | AOI

By combining precision motion technologies with application-specific engineering expertise, PBA continues to develop motion platforms designed to meet the evolving requirements of next-generation semiconductor manufacturing.

The Taipei Automation Show provided an excellent opportunity for PBA to exchange insights with industry professionals and share our latest developments in precision motion technology. We would like to thank DIGITIMES for the opportunity to participate in the Beyond Automation Forum, as well as everyone who attended the session and engaged with our team.

See PBA at SEMICON Taiwan 2026

The conversation continues at SEMICON Taiwan 2026. Visit PBA at Booth Q5830, TaiNEX 2, 1F, to explore our latest thermal compression bonding platform.

September 2–4, 2026
Hall 2, 1F | Booth Q5830

Register

Visit us to discover how PBA Group’s precision motion technologies can support the evolving demands of advanced semiconductor packaging. Engineering Precision for What’s Next.