Representing PBA Group, Daryl Tan, Regional Sales Manager, delivered a presentation titled: “Next-Gen Precision Motion Platform Technologies for Semiconductor Advanced Packaging & CPO in the AI Era.” 

The presentation highlighted how increasingly sophisticated semiconductor packaging processes are driving the need for higher precision, greater motion synchronization and improved thermal stability. The presentation highlighted how increasingly sophisticated semiconductor packaging processes are driving the need for higher precision, greater motion synchronization and improved thermal stability.

Precision Motion For Advanced Packaging

As AI applications continue to accelerate demand for advanced semiconductor packaging and Co-Packaged Optics (CPO), manufacturers face increasingly demanding requirements for precision motion and process control.

PBA showcased its expertise in several key motion technologies, including:

• High-precision thermal compression bonding gantries
• Dual-gantry precision platforms
• Air-bearing platforms
• Multi-axis precision motion control

These technologies are designed to support demanding manufacturing processes where accuracy, stability and coordinated motion are critical.

Addressing Thermal and Motion Challenges

High-temperature processes such as Thermo-Compression Bonding (TCB) can introduce challenges related to thermal expansion and structural deformation.

PBA addresses these challenges by integrating thermal deformation suppression technologies with high-precision, synchronized multi-axis motion control.

These capabilities support advanced semiconductor processes including:

Flip-Chip Bonding | Thermo-Compression Bonding (TCB) | Hybrid Bonding | AOI

By combining precision motion technologies with application-specific engineering expertise, PBA continues to develop motion platforms designed to meet the evolving requirements of next-generation semiconductor manufacturing.

The Taipei Automation Show provided an excellent opportunity for PBA to exchange insights with industry professionals and share our latest developments in precision motion technology.

We would like to thank DIGITIMES for the opportunity to participate in the Beyond Automation Forum, as well as everyone who attended the session and engaged with our team.

See PBA at SEMICON Taiwan 2026

The conversation continues at SEMICON Taiwan 2026. Visit PBA at Booth Q5830, TaiNEX 2, 1F, to explore our latest thermal compression bonding platform.

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PBA Systems is an ISO certified company and a member of the PBA Group. We are experts in ultra-precision motion control and mechatronic solutions. PBA Group specialises in proprietary motion technologies for industrial manufacturing automation. With close to 40 years of expertise, our team is dedicated to developing innovative precision motion solutions that integrate mechanical engineering, electronics, and advanced control systems for a wide range of industries, including semiconductor, automation, photonics/optics, and medical devices. We provide components, motors, systems integration, and custom design services. Headquartered in Singapore, with advanced manufacturing or technology centres in Taiwan, Japan, Korea, Malaysia, Thailand, China, we have the capabilities of providing customised solutions and agile manufacturing support for global customers, equipment makers and system partners. For more information on PBA Systems and its precision motion automation capabilities, please visit www.pbasystems.com.sg/.

PBA Group has over 30 companies in 10 countries and over 500 employees regionally, with a strong Asia focus and global ambitions. For more information on PBA and its motion automation capabilities, please visit www.pbarobotics.com For PBA Systems Sales Contact:

PBA Systems Pte Ltd

Email: [email protected]

Tel: +65 6576 6766

For media queries, please contact:

PBA Group of Companies

Email: [email protected]

Tel: +65 6576 6767